CNC Machining for Electronics | Semiconductor & Heat Sink Parts

 
 
 
 
 
This semiconductor package base is precision CNC-machined for chip packaging and testing applications. It features a smooth, burr-free surface and high-precision pin alignment, meeting strict requirements for cleanliness, dimensional consistency and long-term stability in the semiconductor industry.
 

Our Typical CNC Machined Parts

Copper Cavity / Sputtering Target Base

 
Material: Oxygen-Free Copper (OFC)

CNC machined high-purity copper cavity component with precision inner surface finish. Designed for semiconductor vacuum deposition and sputtering applications, offering excellent thermal conductivity and high vacuum compatibility.

CNC Machined Aluminum Enclosure / Housing Component

 
Material: Aluminum Alloy 6061 / 6063

CNC-machined rectangular aluminum enclosure with precision mounting holes and integrated ports. Designed for housing electronic modules, sensors, and control units in industrial, semiconductor, and automation equipment. Features high structural rigidity, corrosion resistance, and customizable internal/external features.

Our Core Capabilitie




1. High-precision CNC turn-mill composite lathe

 

This Jingfusi turn-mill center is designed for high-efficiency, high-precision machining of complex parts. With integrated turning and milling capabilities, it completes multi-process operations in a single setup, minimizing errors and ensuring consistent quality. It supports the production of aerospace, semiconductor, and medical components with tight tolerances, delivering reliable performance for both prototype and mass production.
 




2. Tight Tolerances

 

Stable ±0.005mm tolerance control, meeting strict Electronics & Semiconductor instrument standards. All parts inspected by CMM to ensure full compliance.

Ready to Start Your Electronics & Semiconductor CNC Project?

Prototype in 2-3 weeks

Low volume accepted

Full engineering support

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